Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808442 | Apparatus for removal/remaining thickness profile manipulation | David Wei, Yehiel Gotkis, Aleksander Owczarz, John M. Boyd | 2004-10-26 |
| 6776695 | Platen design for improving edge performance in CMP applications | Alek Owczarz, John M. Boyd | 2004-08-17 |
| 6767428 | Method and apparatus for chemical mechanical planarization | Yehiel Gotkis, Aleksandar Owczarz | 2004-07-27 |
| 6729943 | System and method for controlled polishing and planarization of semiconductor wafers | Yehiel Gotkis | 2004-05-04 |
| 6705930 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | John M. Boyd, Yehiel Gotkis | 2004-03-16 |