Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808442 | Apparatus for removal/remaining thickness profile manipulation | David Wei, Yehiel Gotkis, Aleksander Owczarz, Rod Kistler | 2004-10-26 |
| 6800020 | Web-style pad conditioning system and methods for implementing the same | Katrina Mikhaylich | 2004-10-05 |
| 6776695 | Platen design for improving edge performance in CMP applications | Alek Owczarz, Rod Kistler | 2004-08-17 |
| 6752703 | Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film | Miguel Saldana, Damon Vincent Williams | 2004-06-22 |
| 6733615 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | Michael S. Lacy | 2004-05-11 |
| 6729339 | Method and apparatus for cooling a resonator of a megasonic transducer | John deLarios, Carl Woods | 2004-05-04 |
| 6705930 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | Yehiel Gotkis, Rod Kistler | 2004-03-16 |
| 6702202 | Method and apparatus for fluid delivery to a backside of a substrate | Carl Woods | 2004-03-09 |
| 6679763 | Apparatus and method for qualifying a chemical mechanical planarization process | Katrina Mikhaylich, Mike Ravkin | 2004-01-20 |