Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664122 | Electroless copper deposition method for preparing copper seed layers | Tatyana N. Andryuschenko, Steven T. Mayer, Eric G. Webb | 2003-12-16 |
| 6653226 | Method for electrochemical planarization of metal surfaces | — | 2003-11-25 |
| 6569299 | Membrane partition system for plating of wafers | Robert J. Contolini, John O. Dukovic | 2003-05-27 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Robert J. Contolini | 2003-05-13 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Karl B. Levy +2 more | 2003-04-29 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Robert J. Contolini | 2003-04-22 |
| 6527920 | Copper electroplating apparatus | Steven T. Mayer, Evan E. Patton, Robert Jackson | 2003-03-04 |