Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642146 | Method of depositing copper seed on semiconductor substrates | Robert T. Rozbicki, Michal Danek | 2003-11-04 |
| 6607977 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Michal Danek | 2003-08-19 |
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Tarek Suwwan de Felipe, Michal Danek, Alexander Dulkin | 2003-05-20 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Michal Danek, Karl B. Levy, Jonathan D. Reid +2 more | 2003-04-29 |
| 6541371 | Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Kwok Fai Lai, Karl B. Levy, J. Patrick Rymer | 2003-04-01 |
| 6541374 | Method of depositing a diffusion barrier for copper interconnection applications | Tarek Suwwan de Felipe, Michal Danek, Ronald A. Powell | 2003-04-01 |