Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Tarek Suwwan de Felipe, Michal Danek, Erich R. Klawuhn | 2003-05-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Tarek Suwwan de Felipe, Michal Danek, Erich R. Klawuhn | 2003-05-20 |