Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652718 | Use of RF biased ESC to influence the film properties of Ti and TiN | Gerard C. D'Couto, George Tkach | 2003-11-25 |
| 6642146 | Method of depositing copper seed on semiconductor substrates | Robert T. Rozbicki, Erich R. Klawuhn | 2003-11-04 |
| 6607977 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Erich R. Klawuhn | 2003-08-19 |
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Tarek Suwwan de Felipe, Erich R. Klawuhn, Alexander Dulkin | 2003-05-20 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Karl B. Levy, Jonathan D. Reid +2 more | 2003-04-29 |
| 6541374 | Method of depositing a diffusion barrier for copper interconnection applications | Tarek Suwwan de Felipe, Erich R. Klawuhn, Ronald A. Powell | 2003-04-01 |
| 6534404 | Method of depositing diffusion barrier for copper interconnect in integrated circuit | Karl B. Levy, Hyoun S. Choe | 2003-03-18 |