Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642146 | Method of depositing copper seed on semiconductor substrates | Michal Danek, Erich R. Klawuhn | 2003-11-04 |
| 6607977 | Method of depositing a diffusion barrier for copper interconnect applications | Michal Danek, Erich R. Klawuhn | 2003-08-19 |
| 6554914 | Passivation of copper in dual damascene metalization | Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Karl B. Levy, Jonathan D. Reid +2 more | 2003-04-29 |