Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Jonathan D. Reid +2 more | 2003-04-29 |
| 6541371 | Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, J. Patrick Rymer | 2003-04-01 |
| 6534404 | Method of depositing diffusion barrier for copper interconnect in integrated circuit | Michal Danek, Hyoun S. Choe | 2003-03-18 |