Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Michal Danek, Erich R. Klawuhn, Alexander Dulkin | 2003-05-20 |
| 6541374 | Method of depositing a diffusion barrier for copper interconnection applications | Michal Danek, Erich R. Klawuhn, Ronald A. Powell | 2003-04-01 |