Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664122 | Electroless copper deposition method for preparing copper seed layers | Tatyana N. Andryuschenko, Jonathan D. Reid, Eric G. Webb | 2003-12-16 |
| 6586342 | Edge bevel removal of copper from silicon wafers | Seshasayee Varadarajan, Andrew J. McCutcheon | 2003-07-01 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Jonathan D. Reid, Robert J. Contolini | 2003-05-13 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Jonathan D. Reid, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Jonathan D. Reid, Robert J. Contolini | 2003-04-22 |
| 6537416 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steve Taatjes, Andy McCutcheon, Jim Schall, Jinbin Feng | 2003-03-25 |
| 6527920 | Copper electroplating apparatus | Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2003-03-04 |