Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569299 | Membrane partition system for plating of wafers | Jonathan D. Reid, John O. Dukovic | 2003-05-27 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Jonathan D. Reid | 2003-05-13 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Jonathan D. Reid | 2003-04-22 |
| 6514393 | Adjustable flange for plating and electropolishing thickness profile control | Andrew J. McCutcheon | 2003-02-04 |