Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6589401 | Apparatus for electroplating copper onto semiconductor wafer | Wayne Fetters | 2003-07-08 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Jonathan D. Reid, Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6527920 | Copper electroplating apparatus | Steven T. Mayer, Robert Jackson, Jonathan D. Reid | 2003-03-04 |