Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Roderick C. Mosely | 2003-08-19 |
| 6555183 | Plasma treatment of a titanium nitride film formed by chemical vapor deposition | Shulin Wang, Ming Xi, Zvi Lando | 2003-04-29 |
| 6548402 | Method of depositing a thick titanium nitride film | Shulin Wang, Ming Xi, Frederick Wu, Ramanujapuram A. Srinivas, Yehuda Demayo +2 more | 2003-04-15 |
| 6533894 | RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition | Sujit Sharan, Gurtej S. Sandhu, Paul Smith | 2003-03-18 |