Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660126 | Lid assembly for a processing system to facilitate sequential deposition techniques | Anh N. Nguyen, Michael Yang, Hua Chung, Anzhong Chang, Xiaoxiong Yuan +1 more | 2003-12-09 |
| 6624064 | Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application | Turgut Sahin, Yaxin Wang | 2003-09-23 |
| 6555183 | Plasma treatment of a titanium nitride film formed by chemical vapor deposition | Shulin Wang, Zvi Lando, Mei Chang | 2003-04-29 |
| 6551929 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2003-04-22 |
| 6548402 | Method of depositing a thick titanium nitride film | Shulin Wang, Frederick Wu, Ramanujapuram A. Srinivas, Yehuda Demayo, Zvi Lando +2 more | 2003-04-15 |