Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551929 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung, Ashok Sinha +1 more | 2003-04-22 |