Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Mei Chang | 2003-08-19 |
| 6518176 | Method of selective formation of a barrier layer for a contact level via | Ted Guo, Liang-Yuh Chen, Suchitra Subrahmanyan | 2003-02-11 |
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Ted Guo, Jing-Pei (Connie) Chou, Liang-Yuh Chen | 2003-01-21 |