Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656831 | Plasma-enhanced chemical vapor deposition of a metal nitride layer | Wei Ti Lee | 2003-12-02 |
| 6605531 | Hole-filling technique using CVD aluminum and PVD aluminum integration | Wei Shi, Liang-Yuh Chen | 2003-08-12 |
| 6537905 | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug | Liang-Yuh Chen, Roderick Craig Mosley, Fusen Chen | 2003-03-25 |
| 6528180 | Liner materials | Wei Ti Lee, Gongda Yao | 2003-03-04 |
| 6518176 | Method of selective formation of a barrier layer for a contact level via | Liang-Yuh Chen, Suchitra Subrahmanyan, Roderick C. Mosely | 2003-02-11 |
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Jing-Pei (Connie) Chou, Liang-Yuh Chen, Roderick C. Mosely | 2003-01-21 |