Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617242 | Method for fabricating interlevel contacts of aluminum/refractory metal alloys | Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Yih-Shung Lin, Girish Dixit | 2003-09-09 |
| 6610189 | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature | Hougong Wang, Bo Zheng, Girish Dixit | 2003-08-26 |
| 6566258 | Bi-layer etch stop for inter-level via | Girish Dixit | 2003-05-20 |
| 6537905 | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug | Liang-Yuh Chen, Ted Guo, Roderick Craig Mosley | 2003-03-25 |
| 6514390 | Method to eliminate coil sputtering in an ICP source | Zheng Xu, Jaim Nulman | 2003-02-04 |