Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627542 | Continuous, non-agglomerated adhesion of a seed layer to a barrier layer | Srinivas Gandikota, Rong Tao, Seshadri Ramaswami | 2003-09-30 |
| 6620670 | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 | Kevin Song, Jallepally Ravi, Shih-Hung Li | 2003-09-16 |
| 6605531 | Hole-filling technique using CVD aluminum and PVD aluminum integration | Ted Guo, Wei Shi | 2003-08-12 |
| 6537905 | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug | Ted Guo, Roderick Craig Mosley, Fusen Chen | 2003-03-25 |
| 6518176 | Method of selective formation of a barrier layer for a contact level via | Ted Guo, Suchitra Subrahmanyan, Roderick C. Mosely | 2003-02-11 |
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Ted Guo, Jing-Pei (Connie) Chou, Roderick C. Mosely | 2003-01-21 |