Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Ted Guo, Liang-Yuh Chen, Roderick C. Mosely | 2003-01-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6509274 | Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate | Ted Guo, Liang-Yuh Chen, Roderick C. Mosely | 2003-01-21 |