Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660622 | Process for removing an underlying layer and depositing a barrier layer in one reactor | Ling Chen, Seshadri Ganguli, Wei Cao | 2003-12-09 |
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Seshadri Ganguli, Wei Cao, Roderick C. Mosely, Mei Chang | 2003-08-19 |
| 6596085 | Methods and apparatus for improved vaporization of deposition material in a substrate processing system | John V. Schmitt, Shih-Hung Li, Anzhong Chang, Ling Chen | 2003-07-22 |
| 6596643 | CVD TiSiN barrier for copper integration | Ling Chen, Hyungsuk Alexander Yoon | 2003-07-22 |
| 6562715 | Barrier layer structure for copper metallization and method of forming the structure | Ling Chen | 2003-05-13 |