Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Howard H. Tang, Tony P. Chiang, Jianming Fu | 2003-09-30 |
| 6610184 | Magnet array in conjunction with rotating magnetron for plasma sputtering | Rong Tao, Zheng Xu | 2003-08-26 |
| 6607640 | Temperature control of a substrate | Arvind Sundarrajan, Darryl Angelo, Tse-Yong Yao | 2003-08-19 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Tony P. Chiang, Barry Chin | 2003-08-12 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6580057 | Enhanced cooling IMP coil support | Richard Hong, James Tsung, Gunnar Vatvedt, Arvind Sundarrajan | 2003-06-17 |
| 6579730 | Monitoring process for oxide removal | Haojiang Li, Suraj Rengarajan | 2003-06-17 |
| 6566259 | Integrated deposition process for copper metallization | Imran Hashim, Barry Chin, Bingxi Sun | 2003-05-20 |
| 6506287 | Overlap design of one-turn coil | — | 2003-01-14 |