Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6630201 | Adsorption process for atomic layer deposition | Karl Leeser, Jeffrey A. Brown, Jason Babcoke | 2003-10-07 |
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Peijun Ding, Howard H. Tang, Jianming Fu | 2003-09-30 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Peijun Ding, Barry Chin | 2003-08-12 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6569501 | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2003-05-27 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Barry Chin | 2003-05-06 |