Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Peijun Ding, Tony P. Chiang, Jianming Fu | 2003-09-30 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Anish Tolia | 2003-06-24 |