Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Peijun Ding, Howard H. Tang, Tony P. Chiang | 2003-09-30 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6579421 | Transverse magnetic field for ionized sputter deposition | — | 2003-06-17 |