Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566259 | Integrated deposition process for copper metallization | Peijun Ding, Barry Chin, Bingxi Sun | 2003-05-20 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Tony P. Chiang, Barry Chin | 2003-05-06 |