Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620956 | Nitrogen analogs of copper II &bgr;-diketonates as source reagents for semiconductor processing | Ling Chen | 2003-09-16 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Peijun Ding, Tony P. Chiang | 2003-08-12 |
| 6566259 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun | 2003-05-20 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2003-05-06 |