Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440843 | Semiconductor device and method for manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2002-08-27 |
| 6436849 | Method for manufacturing semiconductor device having low dielectric constant insulating film, wafer processing equipment and wafer storing box used in this method | Masahiko Hasunuma, Hideshi Miyajima, Rempei Nakata | 2002-08-20 |
| 6407453 | Semiconductor device and method of manufacturing the same | Tadayoshi Watanabe, Sachiyo Ito, Takamasa Usui, Masako Morita, Hirokazu Ezawa | 2002-06-18 |
| 6403462 | Method for manufacturing high reliability interconnection having diffusion barrier layer | Masahiko Hasunuma, Shohei Shima, Sachiyo Ito | 2002-06-11 |
| 6403481 | Film formation method | Tetsuo Matsuda | 2002-06-11 |
| 6375823 | Plating method and plating apparatus | Tetsuo Matsuda, Katsuya Okumura | 2002-04-23 |
| 6368951 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tetsuo Matsuda, Tadashi Iijima +5 more | 2002-04-09 |
| 6348402 | Method of manufacturing a copper interconnect | Takashi Kawanoue, Tetsuo Matsuda, Tadashi Iijima | 2002-02-19 |
| 6342444 | Method of forming diffusion barrier for copper interconnects | Kazuyuki Higashi, Noriaki Matsunaga, Hiroshi Toyoda, Akihiro Kajita, Tetsuo Matsuda | 2002-01-29 |