Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6403481 | Film formation method | Hisashi Kaneko | 2002-06-11 |
| 6403997 | Method for manufacturing semiconductor devices | Seiji Inumiya, Katsuhiko Hieda, Yoshio Ozawa | 2002-06-11 |
| 6375823 | Plating method and plating apparatus | Hisashi Kaneko, Katsuya Okumura | 2002-04-23 |
| 6368951 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tadashi Iijima, Hisashi Kaneko +5 more | 2002-04-09 |
| 6348402 | Method of manufacturing a copper interconnect | Takashi Kawanoue, Hisashi Kaneko, Tadashi Iijima | 2002-02-19 |
| 6342444 | Method of forming diffusion barrier for copper interconnects | Kazuyuki Higashi, Noriaki Matsunaga, Hiroshi Toyoda, Akihiro Kajita, Hisashi Kaneko | 2002-01-29 |