Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342444 | Method of forming diffusion barrier for copper interconnects | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tetsuo Matsuda, Hisashi Kaneko | 2002-01-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342444 | Method of forming diffusion barrier for copper interconnects | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tetsuo Matsuda, Hisashi Kaneko | 2002-01-29 |