UG

Ulrike Gruening

IBM: 13 patents #39 of 5,400Top 1%
Infineon Technologies Ag: 11 patents #15 of 647Top 3%
📍 Wappingers Falls, NY: #1 of 143 inventorsTop 1%
🗺 New York: #18 of 9,277 inventorsTop 1%
Overall (2002): #374 of 266,432Top 1%
17
Patents 2002

Issued Patents 2002

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
6486024 Integrated circuit trench device with a dielectric collar stack, and method of forming thereof Helmut Tews, Alexander Michaelis, Stephan Kudelka, Uwe Schroeder 2002-11-26
6451648 Process for buried-strap self-aligned to deep storage trench Jack A. Mandelman, Carl Radens 2002-09-17
6437388 Compact trench capacitor memory cell with body contact Carl Radens, Jack A. Mandelman 2002-08-20
6437381 Semiconductor memory device with reduced orientation-dependent oxidation in trench structures Rajarao Jammy, Helmut Tews 2002-08-20
6429068 Structure and method of fabricating embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect Ramachandra Divakaruni, Jack A. Mandelman, Larry Nesbit, Carl Radens 2002-08-06
6429092 Collar formation by selective oxide deposition Jochen Beintner, Alexander Michaelis, Oswald Spindler, Zvonimir Gabric 2002-08-06
6426251 Process for manufacturing a crystal axis-aligned vertical side wall device Gary B. Bronner, Jack A. Mandelman, Carl Radens 2002-07-30
6399434 Doped structures containing diffusion barriers Susan E. Chaloux, Johnathan E. Faltermeier, Rajarao Jammy, Christopher C. Parks, Paul C. Parries +2 more 2002-06-04
6399978 Formation of 5F2 cell with partially vertical transistor and gate conductor aligned buried strap with raised shallow trench isolation region Carl Radens 2002-06-04
6376324 Collar process for reduced deep trench edge bias Jack A. Mandelman, Ramachandra Divakaruni, Carl Radens, Akira Sudo 2002-04-23
6372567 Control of oxide thickness in vertical transistor structures Helmut Tews, Brian Lee 2002-04-16
6369419 Self-aligned near surface strap for high density trench DRAMS Ramachandra Divakaruni, Jochen Beintner, Jack A. Mandelman, Johann Alsmeier, Gary B. Bronner 2002-04-09
6362040 Reduction of orientation dependent oxidation for vertical sidewalls of semiconductor substrates Helmut Tews, Brian Lee, Raj Jammy, John Faltermeier 2002-03-26
6359299 Apparatus and method for forming controlled deep trench top isolation layers 2002-03-19
6348374 Process for 4F2 STC cell having vertical MOSFET and buried-bitline conductor structure Satish D. Athavale, Gary B. Bronner, Ramachandra Divakaruni, Jack A. Mandelman, Carl Radens 2002-02-19
6348388 Process for fabricating a uniform gate oxide of a vertical transistor Johnathan E. Faltermeier, Suryanarayan G. Hegde, Rajarao Jammy, Brian Lee, Helmut Tews 2002-02-19
6339241 Structure and process for 6F2 trench capacitor DRAM cell with vertical MOSFET and 3F bitline pitch Jack A. Mandelman, Ramachandra Divakaruni, Carl Radens 2002-01-15