Issued Patents 2002
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Xu Yi, Yakub Aliyu +2 more | 2002-03-19 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Yi Xu, Joseph Xie, Mei Sheng Zhou | 2002-03-05 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Subhash Gupta, Mei Sheng Zhou, Sangki Hong | 2002-03-05 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Mei Sheng Zhou, Subhash Gupta, Yi Xu | 2002-02-26 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Subhash Gupta, Yi Xu, Mei Sheng Zhou | 2002-02-19 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-01-22 |
| 6339021 | Methods for effective nickel silicide formation | Wee Leng Tan, Kin Leong Pey | 2002-01-15 |