Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6961229 | Electronic circuit device | Tamotsu Usami | 2005-11-01 |
| 6914502 | Wiring structure for transmission line having grooved conductors | Tamotsu Usami | 2005-07-05 |
| 6812742 | Electronic device | Tamotsu Usami | 2004-11-02 |
| 6731153 | Semiconductor integrated circuit having switching transistors and varactors | Tamotsu Usami | 2004-05-04 |
| 6693801 | Electronic device | — | 2004-02-17 |
| 6670830 | Driver circuit, receiver circuit, and signal transmission bus system | Tamotsu Usami | 2003-12-30 |
| 6630629 | Wiring substrate | Tamotsu Usami | 2003-10-07 |
| 6625005 | Semiconductor circuit device having power and ground lines adapted for high-frequency operation | Tamotsu Usami | 2003-09-23 |
| 6522173 | Electronic device | — | 2003-02-18 |
| 6476330 | Wiring substrate and process for producing the same | Tamotsu Usami | 2002-11-05 |
| 6373275 | Electronic device capable of greatly improving signal transmission speed in a bus wiring system | Tamotsu Usami | 2002-04-16 |
| 5402318 | Semiconductor integrated circuit device | Takayuki Okinaga, Yuji Shirai, Takashi Miwa, Toshihiro Tsuboi, Shouji Matsugami | 1995-03-28 |
| 5365402 | Cooling apparatus of electronic device | Toshio Hatada, Shigeo Ohashi, Tadakatsu Nakajima, Heikichi Kuwahara, Hitoshi Matsushima +5 more | 1994-11-15 |
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu +2 more | 1994-10-25 |
| 5309011 | Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1994-05-03 |
| 5304844 | Semiconductor device and method of producing the same | Osamu Horiuchi, Gen Murakami, Hiromichi Suzuki, Hajime Hasebe, Yuuji Shirai +2 more | 1994-04-19 |
| 5258649 | Semiconductor device and electronic apparatus using semiconductor device | Akira Tanaka, Kazuji Yamada, Tadahiko Miyoshi | 1993-11-02 |
| 5234866 | Semiconductor device and process for producing the same, and lead frame used in said process | Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Michiaki Furukawa, Yasuyuki Yamasaki | 1993-08-10 |
| 5217922 | Method for forming a silicide layer and barrier layer on a semiconductor device rear surface | Hiroshi Akasaki, Tetsuya Hayashida | 1993-06-08 |
| 5195576 | LSI cooling apparatus and computer cooling apparatus | Toshio Hatada, Hitoshi Matsushima, Yoshihiro Kondou, Hiroshi Inoue, Yuji Shirai +2 more | 1993-03-23 |
| 5191224 | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1993-03-02 |
| 5188280 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more | 1993-02-23 |
| 5126821 | Semiconductor device having inner leads extending over a surface of a semiconductor pellet | Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Michiaki Furukawa, Yasuyuki Yamasaki | 1992-06-30 |
| 5107329 | Pin-grid array semiconductor device | Takayuki Okinaga, Hiroshi Akasaki | 1992-04-21 |
| 5090609 | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals | Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more | 1992-02-25 |