Issued Patents All Time
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5067007 | Semiconductor device having leads for mounting to a surface of a printed circuit board | Masao Kato, Takashi Kumagai, Mitsuo Usami, Shigeo Kuroda, Kunizo Sahara +7 more | 1991-11-19 |
| 5053480 | Polyimide resin from cyclobutane tetracarboxylic acid dianhydride | Noriaki Koto, Toyohiko Abe, Hideo Suzuki | 1991-10-01 |
| 5032895 | Semiconductor device and method of producing the same | Osamu Horiuchi, Gen Murakami, Hiromichi Suzuki, Hajime Hasebe, Yuuji Shirai +2 more | 1991-07-16 |
| 5018004 | Semi-conductor device | Takayuki Okinaga, Shouji Matsugami, Yuuji Shirai, Hiroshi Koguma, Takashi Emata | 1991-05-21 |
| 4965653 | Semiconductor device and method of mounting the semiconductor device | Shigeo Kuroda, Katsuyuki Sato, Hisashi Nakamura, Shinichi Shouji | 1990-10-23 |
| 4965660 | Integrated circuit package having heat sink bonded with resinous adhesive | Satoru Ogihara, Hironori Kodama, Nobuyuki Ushifusa | 1990-10-23 |
| 4943843 | Semiconductor device | Takayuki Okinaga, Hiroshi Tachi, Hiroshi Ozaki, Michiaki Furukawa, Yasuyuki Yamasaki | 1990-07-24 |
| 4886573 | Process for forming wiring on substrate | Hiroshi Watanabe, Osamu Miura, Kunio Miyazaki, Shunichi Numata | 1989-12-12 |
| 4764804 | Semiconductor device and process for producing the same | Kunizo Sahara, Hisashi Ishida | 1988-08-16 |
| 4729010 | Integrated circuit package with low-thermal expansion lead pieces | Masatoshi Tsuchiya, Satoru Ogihara, Hiromi Kagohara, Tomoji Oishi | 1988-03-01 |
| 4630095 | Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering | Kunizou Sahara, Masao Sekibata, Kazumichi Mitsusada, Katsumi Ogiue | 1986-12-16 |
| 4580713 | Method for bonding an aluminum wire | Masao Sekibata, Yoshiyuki Ohzawa | 1986-04-08 |
| 4541003 | Semiconductor device including an alpha-particle shield | Kazumichi Mitsusada, Masao Sekibata, Shinji Ohnishi | 1985-09-10 |
| 4527730 | Wire bonding apparatus | Yuji Shirai, Tamotsu Usami, Yasuyuki Yamasaki | 1985-07-09 |
| 4447661 | Process for producing an alcohol by hydroformylation | Satoshi Hoshiyama, Hiroyuki Muto, Shuzo Shinke, Shinichiro Takigawa, Hiroyuki Yamazaki | 1984-05-08 |