Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4910094 | Multilayer plating method and multilayer plated film | Tetsuya Watanabe | 1990-03-20 |
| 4765528 | Plating process for an electronic part | Toshihiko Ohta, Osamu Miyazawa | 1988-08-23 |
| 4739125 | Electric component part having lead terminals | Yutaka Watanabe, Fumiyuki Kobayashi, Shigeo Kuroda, Akio Yasukawa, Shigejiro Sekine | 1988-04-19 |
| 4630095 | Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering | Kanji Otsuka, Kunizou Sahara, Kazumichi Mitsusada, Katsumi Ogiue | 1986-12-16 |
| 4580713 | Method for bonding an aluminum wire | Kanji Otsuka, Yoshiyuki Ohzawa | 1986-04-08 |
| 4541003 | Semiconductor device including an alpha-particle shield | Kanji Otsuka, Kazumichi Mitsusada, Shinji Ohnishi | 1985-09-10 |