HA

Hiroshi Akasaki

HI Hitachi: 8 patents #5,191 of 28,497Top 20%
HC Hitachi Ulsi Systems Co.: 6 patents #125 of 867Top 15%
HE Hitachi Vlsi Engineering: 4 patents #189 of 666Top 30%
RT Renesas Technology: 2 patents #1,374 of 3,337Top 45%
📍 Wenatchee, WA: #41 of 245 inventorsTop 20%
🗺 Washington: #10,403 of 76,902 inventorsTop 15%
Overall (All Time): #521,791 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
7184330 Semiconductor memory device Kenichi Tajima, Masatoshi Hasegawa, Yousuke Tanaka 2007-02-27
7162671 Semiconductor integrated circuit device, method of testing semiconductor integrated circuit device and method of manufacturing semiconductor integrated circuit device Masatoshi Hasegawa, Shuichi Miyaoka, Masahiro Katayama 2007-01-09
7113434 Semiconductor integrated circuit having programmable delays for generating timing signals with time difference being non-integral multiple of clock cycle Shuichi Miyaoka, Yuji Yokoyama, Masatoshi Hasegawa, Kozaburo Kurita 2006-09-26
6794678 Semiconductor integrated circuit device, method of testing semiconductor integrated circuit device and method of manufacturing semiconductor integrated circuit device Masatoshi Hasegawa, Shuichi Miyaoka, Masahiro Katayama 2004-09-21
6735129 Semiconductor integrated circuit device Shuichi Miyaoka, Yuji Yokoyama, Masatoshi Hasegawa, Kozaburo Kurita 2004-05-11
6570800 High speed clock synchronous semiconductor memory in which the column address strobe signal is varied in accordance with a clock signal Yousuke Tanaka, Masahiro Katayama, Yuji Yokoyama, Shuichi Miyaoka, Toru Kobayashi 2003-05-27
5217922 Method for forming a silicide layer and barrier layer on a semiconductor device rear surface Kanji Otsuka, Tetsuya Hayashida 1993-06-08
5188280 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more 1993-02-23
5107329 Pin-grid array semiconductor device Takayuki Okinaga, Kanji Otsuka 1992-04-21
5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals Takashi Nakao, Yoshiaki Emoto, Koichiro Sekiguchi, Masayuki Iketani, Kunizo Sahara +6 more 1992-02-25