VI

Venkat Iyer

UN Uniquify: 14 patents #1 of 8Top 15%
FS Fairchild Semiconductor: 8 patents #84 of 715Top 15%
IN Intel: 7 patents #5,403 of 30,777Top 20%
UC Uniquify Ip Company: 6 patents #1 of 3Top 35%
FL Flex: 3 patents #36 of 184Top 20%
MI Microchip Technology Incorporated: 3 patents #215 of 958Top 25%
Xerox: 2 patents #3,932 of 8,622Top 50%
SS Sap Se: 1 patents #2,890 of 6,322Top 50%
HO Honeywell: 1 patents #7,507 of 14,447Top 55%
NS National Semiconductor: 1 patents #1,247 of 2,238Top 60%
📍 Sunnyvale, CA: #377 of 14,302 inventorsTop 3%
🗺 California: #8,766 of 386,348 inventorsTop 3%
Overall (All Time): #60,095 of 4,157,543Top 2%
47
Patents All Time

Issued Patents All Time

Showing 26–47 of 47 patents

Patent #TitleCo-InventorsDate
8947140 Continuous adaptive training for data interface timing calibration Prashant Joshi, Jung Lee 2015-02-03
8941422 Method for operating a data interface circuit where a calibration controller controls both a mission path and a reference path Prashant Joshi, Jung Lee 2015-01-27
8941423 Method for operating a circuit including a timing calibration function Prashant Joshi, Jung-Pil Lee 2015-01-27
8664752 Semiconductor die package and method for making the same Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina Estacio, David Chong +6 more 2014-03-04
8600571 Energy optimization system Jim Dillon, Ronald Blagus, Stephen Parr, Alan Houghton 2013-12-03
8212361 Semiconductor die package including multiple dies and a common node structure Rajeev Joshi, Jonathan Klein 2012-07-03
8183088 Semiconductor die package and method for making the same Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina Estacio, Rajeev Joshi +2 more 2012-05-22
8058107 Semiconductor die package using leadframe and clip and method of manufacturing Erwin Victor Cruz, Elsie Agdon Cabahug, Ti Ching Shian 2011-11-15
7772681 Semiconductor die package and method for making the same Rajeev Joshi, Chung-Lin Wu 2010-08-10
7618896 Semiconductor die package including multiple dies and a common node structure Rajeev Joshi, Jonathan Klein 2009-11-17
7285849 Semiconductor die package using leadframe and clip and method of manufacturing Erwin Victor Cruz, Elsie Agdon Cabahug, Ti Ching Shian 2007-10-23
7256479 Method to manufacture a universal footprint for a package with exposed chip Jonathan Almeria Noquil, Connie Tangpuz, Romel N. Manatad, Stephen R. Martin, Rajeev Joshi 2007-08-14
6724848 Sync regeneration in a universal serial bus 2004-04-20
6629186 Bus controller and associated device drivers for use to control a peripheral bus having at least one store-and-forward segment John I. Garney, John S. Howard 2003-09-30
6593768 Dual termination serial data bus with pull-up current source Michael J. Pennell, John T. West, Mitchell Beck 2003-07-15
6567423 Parallel bit stuffing for a serial data transfer protocol 2003-05-20
6546018 Digital system having a peripheral bus structure with at least one store-and-forward segment John I. Garney, John S. Howard 2003-04-08
6389501 I/O peripheral device for use in a store-and-forward segment of a peripheral bus John I. Garney, John S. Howard 2002-05-14
6088811 Method and apparatus for generating both a uniform duty cycle clock and a variable duty cycle clock using a single state machine Vui Yong Liew 2000-07-11
D379194 Supply accessory for a printing or copying machine John Sundquist, Daniel C. Miller 1997-05-13
5046657 Tape automated bonding of bumped tape on bumped die Jagdish G. Belani, Hem Takiar, Rajenda Pendse 1991-09-10
4341456 Transfer system for a xerographic reproduction machine Stephen Borostyan, Timothy T. Blair 1982-07-27