Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410971 | Chip package structure | Tzyy-Jang Tseng, Pu-Ju Lin, Ra-Min Tain | 2022-08-09 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Pu-Ju Lin, Tzyy-Jang Tseng, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2022-08-09 |
| 11366381 | Mask structure and manufacturing method thereof | Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Jui-Jung Chien, Wei-Tse Ho | 2022-06-21 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Ra-Min Tain, Tzyy-Jang Tseng | 2022-06-14 |
| 10957658 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2021-03-23 |
| 10950535 | Package structure and method of manufacturing the same | Chun-Min Wang, Pu-Ju Lin | 2021-03-16 |
| 10925172 | Carrier structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Tse-Wei Wang | 2021-02-16 |
| 10897823 | Circuit board, package structure and method of manufacturing the same | Tzyy-Jang Tseng, Kai-Ming Yang, Chih-Lun Wang | 2021-01-19 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Pei-Wei Wang, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-12-01 |
| 10802637 | Touch-sensing display panel and method of manufacturing the same | Tse-Wei Wang | 2020-10-13 |
| 10756050 | Package structure and bonding method thereof | Tzyy-Jang Tseng, Kai-Ming Yang, Yu-Hua Chen | 2020-08-25 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2020-06-16 |
| 10658282 | Package substrate structure and bonding method thereof | Kai-Ming Yang, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-05-19 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-05-12 |
| 10588214 | Stacked structure and method for manufacturing the same | Tzyy-Jang Tseng, Kai-Ming Yang, Pu-Ju Lin, Yu-Hua Chen | 2020-03-10 |
| 10458893 | Miniaturized particulate matter detector and manufacturing method of a filter | Chia-Wen Chiang, I-Hsing Lin, Hsiang-Hung Chang, Wen-Chih Chen | 2019-10-29 |
| 10324370 | Manufacturing method of circuit substrate and mask structure and manufacturing method thereof | Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Jui-Jung Chien, Wei-Tse Ho | 2019-06-18 |
| 10121673 | Miniaturize particulate matter detector and manufacturing method of a filter | Chia-Wen Chiang, I-Hsing Lin | 2018-11-06 |
| 10083901 | Method for manufacturing circuit redistribution structure | Yu-Hua Chen | 2018-09-25 |
| 9931813 | Bonding structure and method of fabricating the same | Kuan-Neng Chen, Wei-Chung Lo | 2018-04-03 |
| 9887153 | Circuit redistribution structure unit and method for manufacturing circuit redistribution structure | Yu-Hua Chen | 2018-02-06 |
| 9373564 | Semiconductor device, manufacturing method and stacking structure thereof | Wen-Wei Shen, Kuan-Neng Chen | 2016-06-21 |
| 9130080 | Encapsulation of backside illumination photosensitive device | Zhi-Cheng Hsiao, Ming-Ji Dai | 2015-09-08 |
| 8679891 | Heterostructure containing IC and LED and method for fabricating the same | Kuan-Neng Chen, Wei-Chung Lo | 2014-03-25 |