JN

Jonathan Almeria Noquil

TI Texas Instruments: 50 patents #141 of 12,488Top 2%
FS Fairchild Semiconductor: 14 patents #39 of 715Top 6%
CD Ciclon Semiconductor Device: 1 patents #5 of 14Top 40%
📍 Plano, TX: #66 of 4,842 inventorsTop 2%
🗺 Texas: #1,053 of 125,132 inventorsTop 1%
Overall (All Time): #32,444 of 4,157,543Top 1%
66
Patents All Time

Issued Patents All Time

Showing 51–66 of 66 patents

Patent #TitleCo-InventorsDate
8198134 Dual side cooling integrated power device module and methods of manufacture 2012-06-12
8119457 Flip chip MLP with folded heat sink Yong Liu, Jocel P. Gomez 2012-02-21
8049312 Semiconductor device package and method of assembly thereof Juan Alejandro Herbsommer, Osvaldo Jorge Lopez 2011-11-01
7842555 Integrated transistor module and method of fabricating same Rajeev Joshi, Consuelo Tangpuz 2010-11-30
7812437 Flip chip MLP with folded heat sink Yong Liu, Jocel Gomezl 2010-10-12
7777315 Dual side cooling integrated power device module and methods of manufacture 2010-08-17
7682877 Substrate based unmolded package Rajeev Joshi, Consuelo Tangpuz 2010-03-23
7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture Ruben Madrid 2010-02-16
7501702 Integrated transistor module and method of fabricating same Rajeev Joshi, Consuelo Tangpuz 2009-03-10
7492043 Power module flip chip package Seung-yong Choi 2009-02-17
7439613 Substrate based unmolded package Rajeev Joshi, Consuelo Tangpuz 2008-10-21
7335532 Method of assembly for multi-flip chip on lead frame on overmolded IC package Seung-yong Choi, Rajeev Joshi, Chung-Lin Wu 2008-02-26
7256479 Method to manufacture a universal footprint for a package with exposed chip Connie Tangpuz, Romel N. Manatad, Stephen R. Martin, Rajeev Joshi, Venkat Iyer 2007-08-14
7157799 Semiconductor die package including carrier with mask and semiconductor die Maria Cristina Estacio 2007-01-02
7154186 Multi-flip chip on lead frame on over molded IC package and method of assembly Seung-yong Choi, Rajeev Joshi, Chung-Lin Wu 2006-12-26
6645791 Semiconductor die package including carrier with mask Maria Cristina Estacio 2003-11-11