Issued Patents All Time
Showing 126–150 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6357112 | Method of making connection component | Thomas H. DiStefano, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2002-03-19 |
| 6329607 | Microelectronic lead structures with dielectric layers | John W. Smith | 2001-12-11 |
| 6324754 | Method for fabricating microelectronic assemblies | Thomas H. DiStefano | 2001-12-04 |
| 6317974 | Methods for creating wear resistant contact edges | — | 2001-11-20 |
| 6307260 | Microelectronic assembly fabrication with terminal formation from a conductive layer | John W. Smith | 2001-10-23 |
| 6294830 | Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer | — | 2001-09-25 |
| 6284563 | Method of making compliant microelectronic assemblies | — | 2001-09-04 |
| 6274820 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Zlata Kovac | 2001-08-14 |
| 6266874 | Methods of making microelectronic components having electrophoretically deposited layers | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Zlata Kovac | 2001-07-31 |
| 6266872 | Method for making a connection component for a semiconductor chip package | — | 2001-07-31 |
| 6265759 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, John W. Smith | 2001-07-24 |
| 6261863 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Anthony B. Faraci, Belgacem Haba | 2001-07-17 |
| 6253992 | Solder ball placement fixtures and methods | — | 2001-07-03 |
| 6247228 | Electrical connection with inwardly deformable contacts | Thomas H. DiStefano | 2001-06-19 |
| 6239386 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis, Zlata Kovac | 2001-05-29 |
| 6239384 | Microelectric lead structures with plural conductors | John W. Smith | 2001-05-29 |
| 6229100 | Low profile socket for microelectronic components and method for making the same | — | 2001-05-08 |
| 6228686 | Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions | John W. Smith | 2001-05-08 |
| 6221750 | Fabrication of deformable leads of microelectronic elements | — | 2001-04-24 |
| 6218213 | Microelectronic components with frangible lead sections | John W. Smith | 2001-04-17 |
| 6211572 | Semiconductor chip package with fan-in leads | Konstantine Karavakis | 2001-04-03 |
| 6211690 | Apparatus for electrically testing bare printed circuits | — | 2001-04-03 |
| 6208025 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Thomas H. DiStefano, Christopher M. Pickett, John W. Smith | 2001-03-27 |
| 6205660 | Method of making an electronic contact | John W. Smith, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 2001-03-27 |
| 6204091 | Method of assembling a semiconductor chip package | John W. Smith | 2001-03-20 |