Issued Patents All Time
Showing 76–100 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7095054 | Semiconductor package having light sensitive chips | — | 2006-08-22 |
| 7091820 | Methods for manufacturing resistors using a sacrificial layer | — | 2006-08-15 |
| 7067742 | Connection component with peelable leads | Thomas H. DiStefano, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2006-06-27 |
| 7061096 | Multi-surface IC packaging structures and methods for their manufacture | Para K. Segaram, Kevin P. Grundy, Thomas Obenhuber | 2006-06-13 |
| 7049929 | Resistor process | — | 2006-05-23 |
| 7014472 | System for making high-speed connections to board-mounted modules | Para K. Segaram, Thomas Obenhuber, Gary Yasumura | 2006-03-21 |
| 6978538 | Method for making a microelectronic interposer | Thomas H. DiStefano | 2005-12-27 |
| 6972495 | Compliant package with conductive elastomeric posts | — | 2005-12-06 |
| 6938338 | Method of making an electronic contact | John W. Smith, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 2005-09-06 |
| 6933610 | Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby | Para K. Segaram, Belgacem Haba | 2005-08-23 |
| 6906422 | Microelectronic elements with deformable leads | — | 2005-06-14 |
| 6891272 | Multi-path via interconnection structures and methods for manufacturing the same | Belgacem Haba | 2005-05-10 |
| 6888168 | Semiconductor package having light sensitive chips | — | 2005-05-03 |
| 6885106 | Stacked microelectronic assemblies and methods of making same | Philip Damberg, Craig Mitchell, John Riley, Michael Warner | 2005-04-26 |
| 6884120 | Array connector with deflectable coupling structure for mating with other components | Belgacem Haba, Para K. Segaram | 2005-04-26 |
| 6876212 | Methods and structures for electronic probing arrays | — | 2005-04-05 |
| 6856235 | Methods for manufacturing resistors using a sacrificial layer | — | 2005-02-15 |
| 6848173 | Microelectric packages having deformed bonded leads and methods therefor | Masud Beroz, John W. Smith, Belgacem Haba | 2005-02-01 |
| 6847107 | Image forming apparatus with improved transfer efficiency | Konstantine Karavakis | 2005-01-25 |
| 6847101 | Microelectronic package having a compliant layer with bumped protrusions | Konstantine Karavakis | 2005-01-25 |
| 6826827 | Forming conductive posts by selective removal of conductive material | — | 2004-12-07 |
| 6821821 | Methods for manufacturing resistors using a sacrificial layer | — | 2004-11-23 |
| 6821815 | Method of assembling a semiconductor chip package | John W. Smith | 2004-11-23 |
| 6809608 | Transmission line structure with an air dielectric | — | 2004-10-26 |
| 6780747 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 2004-08-24 |