Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12135213 | Sensor positioning apparatus | David M. Gallatin, Dion Damato, Damon Campbell, Ryan Liu | 2024-11-05 |
| 11725715 | Advance and hold pawl actuator | Roger Sharpe, Ryan Liu | 2023-08-15 |
| D945814 | Appliance | Nick DeAngelis, Alexander Soriano, Robert Soper, Yi-Chun Liao, Benjamin Pei-Ming Chia | 2022-03-15 |
| 9647318 | Modular antenna system | — | 2017-05-09 |
| D746798 | Indoor antenna | Peter Schmidt, Lawrence Herman Fong | 2016-01-05 |
| 8598696 | Multi-surface IC packaging structures | Joseph Fjelstad, Para K. Segaram, Thomas Obenhuber | 2013-12-03 |
| 8324727 | Low profile discrete electronic components and applications of same | Joseph Fjelstad, Para K. Segaram, William F. Wiedemann, Thomas Obenhuber | 2012-12-04 |
| 8313333 | Connector having a housing with a conductor with a ramp section and a curved surface section | Gary Yasumura, William F. Wiedermann, Joseph Fjelstad, Para K. Segaram | 2012-11-20 |
| 8244993 | Memory chain | Para K. Segaram | 2012-08-14 |
| 8199450 | ESD protection utilizing radiated thermal relief | Joseph Fjelstad | 2012-06-12 |
| 8079848 | Electrical connector with conductors with a ramp to induce torsion | Gary Yasumura, William F. Wiedemann, Joseph Fjelstad, Para K. Segaram | 2011-12-20 |
| 8047855 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasamura, Joseph Fjelstad, William F. Wiedemann, Para K. Segaram | 2011-11-01 |
| 8026600 | Controlled impedance structures for high density interconnections | Joseph Fjelstad | 2011-09-27 |
| 7973391 | Tapered dielectric and conductor structures and applications thereof | Joseph Fjelstad, Para K. Segaram, Gary Yasumura | 2011-07-05 |
| 7966443 | Memory systems including memory devices coupled together in a daisy-chained arrangement | Para K. Segaram | 2011-06-21 |
| 7919355 | Multi-surface IC packaging structures and methods for their manufacture | Joseph Fjelstad, Para K. Segaram, Thomas Obenhuber | 2011-04-05 |
| 7909615 | Torsionally-induced contact-force conductors for electrical connector systems | Gary Yasumura, William F. Wiedemann, Joseph Fjelstad, Para K. Segaram | 2011-03-22 |
| 7845986 | Torsionally-induced contact-force conductors for electrical connector systems | Gary Yasumura, William F. Wiedemann, Joseph Fjelstad, Para K. Segaram | 2010-12-07 |
| 7837477 | Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasamura, Joseph Fjelstad, William F. Wiedemann, Matthew J. Stepovich | 2010-11-23 |
| 7750446 | IC package structures having separate circuit interconnection structures and assemblies constructed thereof | Joseph Fjelstad, Gary Yasumura | 2010-07-06 |
| 7737545 | Multi-surface IC packaging structures and methods for their manufacture | Joseph Fjelstad, Para K. Segaram, Thomas Obenhuber | 2010-06-15 |
| 7732904 | Multi-surface contact IC packaging structures and assemblies | Joseph Fjelstad, Para K. Segaram, Thomas Obenhuber, William F. Wiedemann | 2010-06-08 |
| 7701323 | Low profile discrete electronic components and applications of same | Joseph Fjelstad, Para K. Segaram, William F. Wiedemann, Thomas Obenhuber | 2010-04-20 |
| 7651382 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasumura, Joseph Fjelstad, William F. Wiedemann, Matthew J. Stepovich | 2010-01-26 |
| 7651336 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasumura, Joseph Fjelstad, William F. Wiedemann, Para K. Segaram | 2010-01-26 |