Issued Patents All Time
Showing 26–50 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8199450 | ESD protection utilizing radiated thermal relief | Kevin P. Grundy | 2012-06-12 |
| 8193042 | Flexible circuit assemblies without solder and methods for their manufacture | — | 2012-06-05 |
| RE43404 | Methods for providing void-free layer for semiconductor assemblies | Thomas H. DiStefano | 2012-05-22 |
| 8148199 | Method of electrically connecting a microelectronic component | — | 2012-04-03 |
| 8148205 | Method of electrically connecting a microelectronic component | — | 2012-04-03 |
| 8114711 | Method of electrically connecting a microelectronic component | — | 2012-02-14 |
| 8093712 | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture | — | 2012-01-10 |
| 8079848 | Electrical connector with conductors with a ramp to induce torsion | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Para K. Segaram | 2011-12-20 |
| 8080874 | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween | Jeremy Werner, Daniel L. Rosenband, Jeremy Matthew Plunkett, William L. Schmidt, David T. Wang +4 more | 2011-12-20 |
| 8067777 | Light emitting diode package assembly | — | 2011-11-29 |
| 8047855 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasamura, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy | 2011-11-01 |
| 8026600 | Controlled impedance structures for high density interconnections | Kevin P. Grundy | 2011-09-27 |
| 7989929 | Direct-connect signaling system | Para K. Segaram, Belgacem Haba | 2011-08-02 |
| 7981703 | Electronic assemblies without solder and methods for their manufacture | — | 2011-07-19 |
| 7973391 | Tapered dielectric and conductor structures and applications thereof | Kevin P. Grundy, Para K. Segaram, Gary Yasumura | 2011-07-05 |
| 7948093 | Memory IC package assembly having stair step metal layer and apertures | — | 2011-05-24 |
| 7943434 | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture | — | 2011-05-17 |
| 7926173 | Method of making a circuit assembly | — | 2011-04-19 |
| 7919355 | Multi-surface IC packaging structures and methods for their manufacture | Para K. Segaram, Thomas Obenhuber, Kevin P. Grundy | 2011-04-05 |
| 7909615 | Torsionally-induced contact-force conductors for electrical connector systems | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Para K. Segaram | 2011-03-22 |
| 7872344 | Microelectronic assemblies having compliant layers | Konstantine Karavakis | 2011-01-18 |
| 7845986 | Torsionally-induced contact-force conductors for electrical connector systems | Gary Yasumura, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy | 2010-12-07 |
| 7837477 | Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasamura, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich | 2010-11-23 |
| 7750446 | IC package structures having separate circuit interconnection structures and assemblies constructed thereof | Kevin P. Grundy, Gary Yasumura | 2010-07-06 |
| 7737545 | Multi-surface IC packaging structures and methods for their manufacture | Para K. Segaram, Thomas Obenhuber, Kevin P. Grundy | 2010-06-15 |