Issued Patents All Time
Showing 51–75 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7732904 | Multi-surface contact IC packaging structures and assemblies | Para K. Segaram, Thomas Obenhuber, Kevin P. Grundy, William F. Wiedemann | 2010-06-08 |
| 7701323 | Low profile discrete electronic components and applications of same | Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas Obenhuber | 2010-04-20 |
| 7651336 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasumura, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy | 2010-01-26 |
| 7652381 | Interconnect system without through-holes | Kevin P. Grundy, Gary Yasumura, William F. Wiedemann, Para K. Segaram | 2010-01-26 |
| 7651382 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich | 2010-01-26 |
| 7613011 | Signal-segregating connector system | Kevin P. Grundy, Gary Yasumura, William F. Wiedemann, Para K. Segaram | 2009-11-03 |
| 7531894 | Method of electrically connecting a microelectronic component | — | 2009-05-12 |
| 7528008 | Method of electrically connecting a microelectronic component | — | 2009-05-05 |
| 7466021 | Memory packages having stair step interconnection layers | — | 2008-12-16 |
| 7408260 | Microelectronic assemblies having compliant layers | Konstantine Karavakis | 2008-08-05 |
| 7404746 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich | 2008-07-29 |
| 7388279 | Tapered dielectric and conductor structures and applications thereof | Kevin P. Grundy, Para K. Segaram, Gary Yasumura | 2008-06-17 |
| 7310239 | IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader | Kevin P. Grundy | 2007-12-18 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths | Para K. Segaram, Belgacem Haba | 2007-12-11 |
| 7280372 | Stair step printed circuit board structures for high speed signal transmissions | Kevin P. Grundy, William F. Wiedemann | 2007-10-09 |
| 7279783 | Partitioned integrated circuit package with central clock driver | Kevin P. Grundy, Para K. Segaram, Thomas Obenhuber | 2007-10-09 |
| 7278855 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasumura, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy | 2007-10-09 |
| 7276400 | Methods of making microelectronic packages with conductive elastomeric posts | — | 2007-10-02 |
| 7227759 | Signal-segregating connector system | Kevin P. Grundy, Gary Yasumura, William F. Wiedemann, Para K. Segaram | 2007-06-05 |
| 7205613 | Insulating substrate for IC packages having integral ESD protection | Kevin P. Grundy | 2007-04-17 |
| 7192320 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich | 2007-03-20 |
| 7176580 | Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip | — | 2007-02-13 |
| 7165316 | Methods for manufacturing resistors using a sacrificial layer | — | 2007-01-23 |
| 7138299 | Method of electrically connecting a microelectronic component | — | 2006-11-21 |
| 7112879 | Microelectronic assemblies having compliant layers | Konstantine Karavakis | 2006-09-26 |