Issued Patents All Time
Showing 101–125 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774317 | Connection components with posts | — | 2004-08-10 |
| 6737265 | Microelectronic unit forming methods and materials | Masud Beroz, Belgacem Haba, Christopher M. Pickett, John W. Smith | 2004-05-18 |
| 6709899 | Methods of making microelectronic assemblies having conductive elastomeric posts | — | 2004-03-23 |
| 6706973 | Electrical connection with inwardly deformable contacts | Thomas H. DiStefano | 2004-03-16 |
| 6700072 | Electrical connection with inwardly deformable contacts | Thomas H. DiStefano | 2004-03-02 |
| 6690186 | Methods and structures for electronic probing arrays | — | 2004-02-10 |
| 6653172 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 2003-11-25 |
| 6635514 | Compliant package with conductive elastomeric posts | — | 2003-10-21 |
| 6586955 | Methods and structures for electronic probing arrays | John W. Smith | 2003-07-01 |
| 6583444 | Semiconductor packages having light-sensitive chips | — | 2003-06-24 |
| 6573609 | Microelectronic component with rigid interposer | John P. Myers | 2003-06-03 |
| 6541867 | Microelectronic connector with planar elastomer sockets | — | 2003-04-01 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Anthony B. Faraci, Belgacem Haba | 2003-04-01 |
| 6518662 | Method of assembling a semiconductor chip package | John W. Smith | 2003-02-11 |
| 6518160 | Method of manufacturing connection components using a plasma patterned mask | Belgacem Haba, David Light | 2003-02-11 |
| 6499216 | Methods and structures for electronic probing arrays | — | 2002-12-31 |
| 6486003 | Expandable interposer for a microelectronic package and method therefor | — | 2002-11-26 |
| 6486547 | Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet | John W. Smith | 2002-11-26 |
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, John W. Smith | 2002-10-22 |
| 6465878 | Compliant microelectronic assemblies | Konstantine Karavakis | 2002-10-15 |
| 6465747 | Microelectronic assemblies having solder-wettable pads and conductive elements | Thomas H. DiStefano | 2002-10-15 |
| 6458681 | Method for providing void free layer for semiconductor assemblies | Thomas H. DiStefano | 2002-10-01 |
| 6417029 | Compliant package with conductive elastomeric posts | — | 2002-07-09 |
| 6373128 | Semiconductor assemblies with reinforced peripheral regions | Konstantine Karavakis | 2002-04-16 |
| 6361959 | Microelectronic unit forming methods and materials | Masud Beroz, Belgacem Haba, Christopher M. Pickett, John W. Smith | 2002-03-26 |