Issued Patents All Time
Showing 151–175 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6196042 | Coining tool and process of manufacturing same for making connection components | Thomas H. DiStefano, Belgacem Haba | 2001-03-06 |
| 6177636 | Connection components with posts | — | 2001-01-23 |
| 6157075 | Semiconductor assemblies with reinforced peripheral regions | Konstantine Karavakis | 2000-12-05 |
| 6133072 | Microelectronic connector with planar elastomer sockets | — | 2000-10-17 |
| 6130116 | Method of encapsulating a microelectronic assembly utilizing a barrier | John W. Smith | 2000-10-10 |
| 6107682 | Compliant wirebond packages having wire loop | — | 2000-08-22 |
| 6107123 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 2000-08-22 |
| 6093584 | Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads | — | 2000-07-25 |
| 6086386 | Flexible connectors for microelectronic elements | Thomas H. DiStefano, Konstantine Karavakis, Anthony B. Faraci, Tan Nguyen | 2000-07-11 |
| 6007349 | Flexible contact post and post socket and associated methods therefor | Thomas H. DiStefano | 1999-12-28 |
| 6001671 | Methods for manufacturing a semiconductor package having a sacrificial layer | — | 1999-12-14 |
| 6002168 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Thomas H. DiStefano, Christopher M. Pickett, John W. Smith | 1999-12-14 |
| 5989936 | Microelectronic assembly fabrication with terminal formation from a conductive layer | John W. Smith | 1999-11-23 |
| 5989939 | Process of manufacturing compliant wirebond packages | — | 1999-11-23 |
| 5983492 | Low profile socket for microelectronic components and method for making the same | — | 1999-11-16 |
| 5980270 | Soldering with resilient contacts | Thomas H. DiStefano, John W. Smith | 1999-11-09 |
| 5966587 | Methods of making semiconductor assemblies with reinforced peripheral regions | Konstantine Karavakis | 1999-10-12 |
| 5934914 | Microelectronic contacts with asperities and methods of making same | John W. Smith, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 1999-08-10 |
| 5904498 | Connection component with releasable leads | — | 1999-05-18 |
| 5834339 | Methods for providing void-free layers for semiconductor assemblies | Thomas H. DiStefano | 1998-11-10 |
| 5821608 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, John W. Smith | 1998-10-13 |
| 5821609 | Semiconductor connection component with frangible lead sections | Thomas H. DiStefano, John W. Smith, Konstantine Karavakis | 1998-10-13 |
| 5812378 | Microelectronic connector for engaging bump leads | John W. Smith, Thomas H. DiStefano, A. Christian Walton | 1998-09-22 |
| 5807453 | Fabrication of leads on semiconductor connection components | John W. Smith | 1998-09-15 |
| 5802699 | Methods of assembling microelectronic assembly with socket for engaging bump leads | John W. Smith, Thomas H. DiStefano, A. Christian Walton | 1998-09-08 |