Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu +2 more | 2020-07-28 |
| 10658410 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yeur-Luen Tu, Min-Ying Tsai | 2020-05-19 |
| 10658409 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, I-Nan Chen, Tzu-Hsiang Chen, Yu-Jen Wang, Cheng-Hsien Chou +1 more | 2020-05-19 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2019-12-17 |
| 10475828 | Image sensor device structure with doping layer in light-sensing region | Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting, Wei Chuang Wu +2 more | 2019-11-12 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu +2 more | 2019-10-29 |
| 10396712 | Transformer feed-back quadrature voltage controlled oscillator for correcting dynamic phase error and communication apparatus using the same | Hsiao-Chin Chen, Chien-Te Yu | 2019-08-27 |
| 10304886 | Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor | Dun-Nian Yaung, Hsiao-Hui Tseng, Jen-Cheng Liu, Yu-Jen Wang, Chun-Yuan Chen | 2019-05-28 |
| 10276618 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2019-04-30 |
| 10147752 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting, Wei Chuang Wu +1 more | 2018-12-04 |
| 10097136 | Transformer feed-back quadrature voltage controlled oscillator for correcting dynamic phase error and communication apparatus using the same | Hsiao-Chin Chen, Chien-Te Yu | 2018-10-09 |
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang, Shyh-Fann Ting +2 more | 2018-08-28 |
| 9954022 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2018-04-24 |
| 9812483 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting, Wei Chuang Wu +1 more | 2017-11-07 |
| 9754993 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Hsiao-Hui Tseng, Chih-Yu Lai, Shih Pei Chou, Min-Ying Tsai | 2017-09-05 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang, Shyh-Fann Ting +2 more | 2017-08-08 |
| 9704904 | Deep trench isolation structures and methods of forming same | Chih-Yu Lai, Cheng-Hsien Chou, Cheng-Yuan Tsai, Yeur-Luen Tu | 2017-07-11 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Hsiao-Hui Tseng, Ming-Tsong Wang +2 more | 2017-01-03 |
| 8686527 | Porous Si as CMOS image sensor ARC layer | Shyh-Fann Ting, Ching-Chun Wang | 2014-04-01 |
| 7899727 | System and method for securities information service | — | 2011-03-01 |