Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue +1 more | 2024-05-21 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-03-19 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Ting-Ya Lo, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-03-05 |
| 11908792 | Semiconductor device comprising cap layer over dielectric layer and method of manufacture | Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-20 |
| 11901221 | Interconnect strucutre with protective etch-stop | Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-13 |
| 11894266 | Metal capping layer and methods thereof | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2024-02-06 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng +3 more | 2023-12-26 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee +1 more | 2023-11-07 |
| 11769695 | Semiconductor structure including low-resistance interconnect and integrated circuit device having the same | Hsin-Yen Huang, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2023-09-26 |
| 11756878 | Self-aligned via structure by selective deposition | Hsin-Yen Huang, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2023-09-12 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shau-Lin Shue, Hsiao-Kang Chang, Cherng-Shiaw Tsai | 2023-05-02 |
| 11557511 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2023-01-17 |
| 11538749 | Interconnect structure | Hsin-Yen Huang, Cheng-Chin Lee, Kuang-Wei YANG, Ting-Ya Lo, Chi-Lin Teng +2 more | 2022-12-27 |
| 11527435 | Metal capping layer and methods thereof | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-12-13 |
| 11450566 | Semiconductor device and manufacturing method thereof | Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen | 2022-09-20 |
| 11361989 | Method for manufacturing interconnect structures including air gaps | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-06-14 |
| 11355430 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue +1 more | 2022-06-07 |
| 11355390 | Interconnect strucutre with protective etch-stop | Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2022-06-07 |
| 11335596 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-05-17 |
| 11322395 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee +1 more | 2022-05-03 |
| 11227833 | Interconnect structure and method for forming the same | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-01-18 |
| 11222843 | Interconnect structure and method for forming the same | Hsin-Yen Huang, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-01-11 |
| 11189560 | Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture | Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2021-11-30 |
| 11075113 | Metal capping layer and methods thereof | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2021-07-27 |