Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7446047 | Metal structure with sidewall passivation and method | Yung-Cheng Lu | 2008-11-04 |
| 7423347 | In-situ deposition for cu hillock suppression | Chung-Hsien Chen, Chun-Chieh Lin, Shau-Lin Shue | 2008-09-09 |
| 7413976 | Uniform passivation method for conductive features | Chien-Hsueh Shih, Hung-Wen Su | 2008-08-19 |
| 7332435 | Silicide structure for ultra-shallow junction for MOS devices | Chien-Hsueh Shih, Shih-Wei Chou, Hung-Wen Su | 2008-02-19 |
| 7259463 | Damascene interconnect structure with cap layer | Jui Jen Huang, Shau-Lin Shue, Hung-Wen Su, Ting-Chu Ko | 2007-08-21 |
| 6995089 | Method to remove copper without pattern density effect | Shih-Wei Chou, Winston Shue | 2006-02-07 |
| 6872627 | Selective formation of metal gate for dual gate oxide application | Sheng-Hsiung Chen | 2005-03-29 |
| 6555474 | Method of forming a protective layer included in metal filled semiconductor features | Cheng-Lin Huang, Winston Shue, Mong-Song Liang | 2003-04-29 |