Issued Patents All Time
Showing 151–175 of 195 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9536762 | Method and apparatus for thermal mapping and thermal process control | Chun Hsiung Tsai | 2017-01-03 |
| 9520477 | Semiconductor device and fabricating method thereof | Chi-Cheng Hung, Yu-Sheng Wang, Ying-Lang Wang | 2016-12-13 |
| 9515072 | FinFET structure and method for manufacturing thereof | Chun Hsiung Tsai, Chun-Lung Ni | 2016-12-06 |
| 9508556 | Method for fabricating fin field effect transistor and semiconductor device | Chun Hsiung Tsai, Chien-Tai Chan, Ziwei Fang | 2016-11-29 |
| 9502647 | Resistive random-access memory (RRAM) with a low-K porous layer | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Ying-Lang Wang +2 more | 2016-11-22 |
| 9502290 | Oxidation-free copper metallization process using in-situ baking | Yu-Sheng Wang, Shih-Ho Lin, Szu-An Wu, Ying-Lang Wang | 2016-11-22 |
| 9401274 | Methods and systems for dopant activation using microwave radiation | Chun Hsiung Tsai, Huai-Tei Yang, Kuo-Feng Yu | 2016-07-26 |
| 9368394 | Dry etching gas and method of manufacturing semiconductor device | Yu-Li Hung, Te-Ming Kung, Chih-Hao Chen, Ying-Lang Wang, Hung Jui Chang +1 more | 2016-06-14 |
| 9368540 | CIS image sensors with epitaxy layers and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Chi-Cherng Jeng | 2016-06-14 |
| 9356059 | BSI image sensor chips and methods for forming the same | Shiu-Ko JangJian, Ying-Lang Wang | 2016-05-31 |
| 9349902 | System and method for reducing irregularities on the surface of a backside illuminated photodiode | Shiu-Ko JangJian, Chi-Cherng Jeng, Min Hao Hong | 2016-05-24 |
| 9339912 | Wafer polishing tool using abrasive tape | Tang-Kuei Chang, Kuo-Hsiu Wei, Wei-Jen Lo, Ying-Lang Wang | 2016-05-17 |
| 9281475 | Resistive random-access memory (RRAM) with multi-layer device structure | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Ying-Lang Wang +2 more | 2016-03-08 |
| 9254548 | Method of forming diamond conditioners for CMP process | Yen-Chang Chao, Ying-Lang Wang | 2016-02-09 |
| 9224691 | Semiconductor device contact structures | Shih-Chieh Chang, Chih-Chung Chang, Ying-Lang Wang | 2015-12-29 |
| 9120194 | Apparatus for wafer grinding | Kuo-Hsiu Wei, Ying-Lang Wang, Chun-Ting Kuo | 2015-09-01 |
| 9070664 | Device with MOS device including a secondary metal and PVD tool with target for making same | Shih-Chieh Chang, Ying-Lang Wang | 2015-06-30 |
| 9064770 | Methods for minimizing edge peeling in the manufacturing of BSI chips | Chun-Ting Kuo, Ying-Lang Wang, Kuo-Hsiu Wei | 2015-06-23 |
| 8890273 | Methods and apparatus for an improved reflectivity optical grid for image sensors | Shiu-Ko JangJian, Ying-Lang Wang | 2014-11-18 |
| 8889461 | CIS image sensors with epitaxy layers and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Chih-Cherng Jeng | 2014-11-18 |
| 8847286 | Image sensor and method of manufacturing | Shiu-Ko JangJian, Szu-An Wu, Ying-Lang Wang | 2014-09-30 |
| 8772899 | Method and apparatus for backside illumination sensor | Shiu-Ko JangJian, Min Hao Hong, Ying-Lang Wang | 2014-07-08 |
| 8552529 | Semiconductor device | Jung-Chih Tsao, Yu-Sheng Wang, Ying-Lang Wang | 2013-10-08 |
| 8551193 | Nickel alloy target including a secondary metal | Shih-Chieh Chang, Ying-Lang Wang | 2013-10-08 |
| 8531036 | Via/contact and damascene structures | Shih-Chieh Chang, Ying-Lang Wang, Jung-Chih Tsao, Yu-Sheng Wang | 2013-09-10 |